Special Issue "Advanced RF, Microwave, and Millimeter-Wave Circuits and Systems"

MDPI Electronics Journal Special Issue "Advanced RF, Microwave, and Millimeter-Wave Circuits and Systems"
Deadline for manuscript submissions (extended): 15 August 2023.
Details: https://www.mdpi.com/si/107066

To submit a manuscript, please visit the above-mentioned link and click on the "Submit to Special Issue" tab located on the left menu.

Dear Colleagues,

RF/microwave circuits and systems play a crucial role in all modern wireless communication and Internet of Things (IoT) applications. It is no exaggeration to claim that not even a single aspect of our lives is untouched by RF/microwave technologies; they are ubiquitous—from the wireless doorbell to keyless entry to our cars, from cooking to industrial heating, from cell phone to computer systems, from medicine to space technologies, they are everywhere. The vast and rapid technological development at many levels (e.g., in semiconductor device technologies, simulation models, component miniaturization, and system architectures to name a few) has enabled this enormous penetration of RF/microwave circuits and systems in our modern lives.

This Special Issue of the MDPI journal Electronics entitled "Advanced RF, Microwave, and Millimeter-Wave Circuits and Systems" solicits original contributions with a special focus on recent developments in the analysis, design, implementation, and measurement of MIC, MMIC, and CMOS RF and microwave circuits and systems. Topics of interest include a vast array of passive and active circuits and systems (including, but not limited to): impedance-matching networks, filters, device modeling, amplifiers (PAs and LNAs), RF transceivers, digital predistortion (DPD), power dividers/combiners, couplers, antennas, diplexers/multiplexers, wireless power transfer, energy harvesting, etc. Authors are welcome to submit regular research articles as well as nicely written review papers.

Dr. Mohammad A. Maktoomi (The University of Scranton)

Dr. Tutku Karacolak (Washington State University Vancouver)

Dr. Mohamed Helaoui (University of Calgary)

Dr. Syed Azeemuddin (International Institute of Information Technology)

Guest Editors

Details: https://www.mdpi.com/si/107066